63/37 Eutectic Tin Solder

63/37 eutectic tin solder is an ASTM B32 Sn63 tin-lead alloy designed for a direct change from liquid to solid, without an appreciable pasty phase. This feature helps reduce cold joints when working on electronics, wiring, connectors, terminals, panels and electrical repairs where movement of the part during cooling can affect point quality. It differs from 30/70, 40/60 and 50/50 alloys because it is not intended to fill or shape a wide seam, but to form a clean, fast and repeatable joint. Because it contains lead, it must be used only where the equipment or maintenance specification allows it; for lead-free assemblies, tin-copper or tin-silver alloys under the required standard must be evaluated.

Selection guide

• Choose 63/37 for electronics, terminals and small joints requiring clean solidification.
• Avoid using it as thick filler on radiators or sheet; more pasty alloys are suitable for that.
• Verify compatibility with the project's or serviced equipment's lead policy.
• Define whether solder with flux core, wire or industrial packaging is required.

Use recommendations

• Use a clean tip and controlled temperature to avoid excessive oxidation.
• Pre-tin wires or terminals when the joint requires it.
• Do not move the part while it solidifies to avoid cracks or a dull finish.
• Clean flux residues if the process or service environment requires it.

SoldaForce supplies 63/37 solder for electrical maintenance, industrial electronics and technical assembly upon request. We dispatch to Bogotá, Medellín, Cali, Barranquilla and all of Colombia. Request a quote via WhatsApp with packaging, quantity and application.